TMPCSPTrainingMaterial--New1.ppt

AMD_template_general TMP CSP Training Material TMP Training Group 11/06/06 Training Content Introduction Assembly Process Flow TMP Process Flow Test Operation MP Operation Introduction CSP – Chip Scale Package FBGA package – Fine-Pitch Ball Grid Array MCP package – Multi Chip Package FBGA Packages MCP Packages : 2 Die Stack FBGA Package Code MCP Package Code Package Matrix Test Operation Tray packing TMP CSP Training Material --- FBA Package 3.100% VM Top side 在 2D marker之后检查 Top Side focus on marking quality Missing cover tray at 2D marker output stack Marking VM a Right marking b W