S10002 产品简介.pptVIP

广东生益科技股份有限公司 ◇ 高Tg、低介电常数覆铜板 S1000-2（Laminate）/ S1000-2B（Prepreg）: Laminate Tg (DSC) ≥170℃ Decomposition Temperature(Td) Z-axis Coefficient of thermal expansion Test T-288 Test T-300 Test Excellent anti-CAF performance Test Condition ：85℃/85%RH，DC 50V Sample Construction ：TH-TH 0.70 mm, Space 0.25 mm, L-L 0.10 mm Through-Hole reliability(Q1000) Permittivity and Loss Tangent General Property 粘结片指标（Prepreg Availability） 压合程序（Press Cycle） Press Parameters Heat-up rate We recommend you adopt slow heat rise rate when pressing multilayer boards. 1.5-2.5℃/min of he