超大CMOS集成电路原理chapter2.pptVIP

* Tape-Automated Bonding (TAB) * Flip-Chip Bonding * Package-to-Board Interconnect * Package Types * Package Parameters * Multi-Chip Modules EE141 * EE141 ? Digital Integrated Circuits2nd Manufacturing * Digital Integrated CircuitsA Design Perspective ManufacturingProcess Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic * CMOS Process * A Modern CMOS Process Dual-Well Trench-Isolated CMOS Process * Circuit Under Design * Its Layout View * The Manufacturing Process For a great tour through the IC manufacturing process and its different steps, check /semiconductors/semiconductors.html * ox