《入门级专业英文词汇.pptVIP

2013-11-15 PCB入 门 级 专 业 英 语 词 汇 物料篇 Laminate 层压板 Base material 基材 CCL (Copper-clad laminate) 覆铜板 PP ( Prepreg ) 胶片,预浸或半固化片,常用的有1080/2113/2116 /7628等. Resin, Epoxy Resin 树脂,环氧树脂 Woven glass fabric 玻璃纤维布 Core 芯板 Copper foil 铜箔,主要使用的铜箔有HOZ/1OZ等. Rolled copper foil 压延铜箔 THE 铜箔( High temperature elongation electrodeposited copper foil) 高延展性电解铜箔 Kraft Paper 牛皮纸 Peelable mask 兰胶 Kapton tape 高温胶 Carbon ink 碳油 Solder mask/Solder resist ink 阻焊油墨 Thermosetting type ink 热固化油墨 Silkscreen/Component mark/Legend 字符 Solder, Tin/Lead solder 焊料,铅锡焊料 Drill bit, Rout bit /milling cutter 钻咀,锣刀,铣刀 Chemical 化学的 Dry film 干膜,是一种能感光,显像,抗电镀,抗蚀刻之阻剂 TG (Temperature of Glass Transition) 玻璃态转换温度 CTE( Coefficient of Thermal Expansion) 热膨胀系数 CTI( Comparative Tracking Index ) 相对漏电指数 Anti-CAF( conductive anodic filament ) 耐离子迁移 Dielectric constant 介电常数(DK/Er) TD( Temperature of Decompose) 热裂分解温度 RoHS( Restriction of Hazardous Substances Directive )危害性物质限制指令 (Lead铅 , Mercury汞 , Cadmium镉 , Chromium (VI)六价铬 , Polybrominated biphenyls ( PBB’s)多溴联苯, Polybrominated diphenyl ethers ( PBDE’s)多溴联苯醚) 工艺篇 Laminate cutting 开料,裁板 Baking 烤板 Desmear 除胶渣 PTH( Plated-Through-Hole) 镀通孔,也指沉铜 Plasma cleaner 等离子清洗 Panel plating 全板电镀,也叫整板电镀 Pattern plating 图形电镀 Image transfer 图形转移 Tin Stripping 褪锡 Etching 蚀刻 Under cut 侧蚀 SES 褪膜-蚀刻-褪锡连线(碱性蚀刻线) DES 显影-蚀刻-褪膜连线(酸性蚀刻线) Etching factor 蚀刻因子(蚀刻系数),主要用来衡量侧蚀量的大小,蚀刻 因子=2*铜厚/(下线宽-上线宽) Solder mask printing 印阻焊 Exposure 曝光 UV cure UV固化(ultraviolet) LPI( Liquid Photo Image) 液体感光成像 Developing 显影 Silkscreen stencil 丝印钢网，简称丝网 Aluminum sheet 铝片 Scrubbing 磨边 DI water 纯水,去离子水( Deionization),由树脂对无物理大颗粒的水体进行阴阳离子的吸附,常见的有钙离子/氯离子/镁离子等 HASL (Hot Air Soldering Level) 喷锡,热风整平 LF-HASL (lead free-hot air soldering level) 无铅喷锡 ENIG/Immersion gold沉金(沉镍金, Electroless Nickel/Immersion Gold ) ENEPIG ( electroless nickel electroless palladium immersion gold )沉镍钯金 HDI( High Density Interconnector )高密度互连 Flash gold 水金(电薄金) Hard gold 厚金 Immersion Tin 沉锡 OSP / Entek (Organic Solderability Preservatives) 有