led 培训课程led 培训课程.doc

LED培训课程 Led training course Five original material of LED The five original material of led Respectively refers to：chip, lead frame, Silver Epoxy (insulation glue),gold wire, epoxy resin. 晶片Chip 晶片的构成：由金垫、P极、N极、PN结，背金层构成（双pad晶片无背金层）composition of chip：gold pads, P pole, N pole, p-n junction, back gold layer (double pad chip has no back gold layer) 晶片的定义：晶片是由P层半导体元素，N层半导体元素靠电子移动而重新排列组合在的PN结合体，也正是这种变化使晶片能够处于一个相对稳定的状态。definition of chip：the chip is a new combination of p-n junction semiconductor element by the P-layer, an N-layer semiconductor element by the electronic mobile rearrange ，and it is this change so that the chip can be in a relatively stable state. 晶片的发光原理：在晶片被一定的电压施加正向电极时，正向P区的空穴则会源源不断的游向N区，N区的电子则会相对于孔穴向P区运动。在电子，空穴相对移动的同时，电子空穴互相结对，激发出光子，产生光能。 luminous principle of chip：when applying a certain voltage in positive electrode of the chip，the hole of positive P area will continuously swam to N area, electron of N area will move to P area relatively .electron and hole get combination of each other，stimulate photons, create light at the same time。 支架 Lead frame 2．1）支架的结构：层铁，层镀铜（导电性好，散热快），层镀镍（防氧化）层镀银（反光性好，易焊线）struction of lead frame：layer iron, layer copper plating（good electrical conductivity，fast heat dissipation），Layer nickel plating（anti-oxidation）Layer of silver plating（good reflection，easy to wire bonding） 2．2）支架型号分类：2002、2003、2004、2009、食人鱼.... lead frame type classification：2002、2003、2004、2009、Piranha.... 3、银胶Silver Epoxy（因种类较多，以住友F3007-20为例）（for sort is too many，we got zhuyou F3007-20 as an example ） 3．1）组成：银粉（导电、散热、固定晶片）+环氧树脂（固化银粉）+稀释剂（易于搅拌）Composition：silver powder（electrical conductive, heat dissipation, chips bonding）+ epoxy resin（curing silver powder）+ diluent (easily stirred) 3．2）使用条件use condition： ①、储藏条件：3个月（保存条件：5-15℃）storage condition：3 mouths（storage conditions：5-15℃）storage conditions 15-40℃） DX-20℃storage conditions：-20℃ 6 mouths ②、烘烤条件：150℃/1.5H baking Condition：150℃/1.5H ③、顺一个方向均匀搅拌15分钟 one direction Stir 15 minutes