PROCESSFLOWOFCS-24.pptVIP

Yield Improvement Defect reduction Process window characterization Process weakness Sweet spot Hardware control / PM / Lifetime Design improvement Innovation Manufacturing Process Integration Engineer Process Related and Modules FEOL BEOL Q-time, Rework, KLA Process control CD, overlay, thickness Device/ Product characteristic Photo Etch Thin Film Diffusion Ion Implantation CMP Clean Multilevel Interconnect STI, Salicide Contact/ Via, Metal Passivation Alignment mark Technology readiness New technology development New product experiment Process parameters/SPEC setting Product and Process q