ReducingDefectsandCostsWithAdhesivePrinting.docVIP

Reducing Defects and Costs With Adhesive Printing by Steve Beck and Richard Lieske Adhesive dispensing for SMT components is a process that many manufacturing engineers wish would disappear, but somehow it never does. Problems with adhesive dispensing include components falling off in the wave, adhesive in solder joints and, sometimes, adhesive in places it shouldn’t be. Just about the time an engineer thinks the process is under control, something goes astray. Very often, manufacturability design review teams tell designers to “get as many of those SMT parts to the top as possible,” only