MEMS复习攻略..docxVIP

特此感谢：卓著、王明斗、兰天翔、唐小涛、周孝吉对本攻略的贡献。董建鹏 2015/1/14简述：1、只是包含MEMS中需要自己总结的内容比较多的知识（除ppt6-7一些琐碎的概念，其他章节部分需要总结的基本已涵盖）。2、时间仓促，做得可能不是很完善请谅解。3、英语水平有限，单词语法错误自己改正4、若有错误或没有涉及到的还望大家补充改正（英语）。5、.祝各位取得好成绩！！！！！difference:MEMS is a process technology used to create tiny integrated devices or systems that combine mechanical and electrical components. NEMS is a great development of MEMS. Content: (1) Scale size (2) Material (3) Process technologyMEMSNEMSBasicmaterialSiliconCarbonMEMS NEMS Scale Size 1.Component:1um~100um2.Device :0.1mm~1mm 1nm~100nm (4) Principle (5) Feature (6) Application (自己酌情删减)MEMSNEMSProcess technology1.Miniaturized machine tool2.Wet etching3.Dryetching(RIE AND DRIE )4.Electro discharge machining(EDM):5.LIGA(X-ray)1.AFM/STM induced oxidation method2.Electron-beam lithography(20nm)3.Atom or molecule assembly techniqueMEMSNEMSprinciple1.High power density (Micro-scale effect)2.Large surface area to volume ratio makes surface effects dominant over volume effect. 3.Large thermal conductivity 1.Nano-scale effect 2.Quantum effect3.Interfacial effect MEMS NEMS feature1.Two dimension or quasi- Three dimension Structure 2.High precision 2-D control3.Integration mass production4.low power and less inertia 1.Ultra-small dimension2.Ultra-high frequency Response(more than 100MHZ) 3.Ultro-low power MEMSNEMSApplication1.Targeted drug delivery system2.Miniature robot system 1.Biological motor2.Ultra-high frequency RF resonator 扰动执行器的组成及其运动过程：Scratch Drive Actuator (SDA)（1）component：plate bushing insulator（绝缘体） substrate (2) processApplied voltage bends SDA downwardWhen released, SDA returns to original shapeReapplying voltage causes SDA to move a distance ’dx’Pattern transfer（1）thin film on substrate Silicon dioxide is deposited as structural or sacrificial on the substrate by PVD or CVD. （2）photoresist coatedResist typically 1 um. Spin resist always be used to achieve a uniform thin surface.（3）pattern photoresistWafer is transferred to an exposure system where it is placed