FCBGA焊锡连接.pptVIP

FCBGA Brittle Solder Joint Study Agenda FCBGA Solder Joint Fracture Identification FCBGA Solder Joint Crack Failure Mechanism Root Cause Hypothesis Surface analysis for Alpha vs. Senju solder ball with TEM, XPS, FIB, SEM, TOFSIMS data. Key learning Problem statement Core customers ( Dell, IBM, Sony, Compaq…) experiencing failures isolated to MCH chipset component on D850LJ. BGA opens manifesting at the customer’s systems assembly site after passing electrical test at FEM. Solder Joint Crack Identification Solder Joint Formation The Au surface plating on the pad dissolves during BGA attach and an intermetallic is formed between the Sn in the solder and the Ni on the pad. Thin P-rich Ni (Ni-P+) layer is created as the Ni diffuses out to form the intermetallic with Sn. FA indicates that the interface of failure is at the top of this Ni-P+ (Ni3P) layer. Between the Sn/Ni intermetallic the Ni-P+ layer . Patches of solder still intact on the component land after mechanical peeling. Also a P rich layer is observed on most of the land surface with some spots of Ni3Sn4 IMC (seen as small white spots) scattered around it. No P detected on the solder ball fracture surface. SEM imaging reveals mud crack signature (x-sections to follow), with patches of Ni3Sn4 IMC on the land surface. No contamination detected based by EDS analysis. Cross-Section of Failing Land Pad (after peel test) Modeling Results On Solder Mask Pattern Solder resist undercut creates high stress concentration at critical Ni/intermetallic layer interface, greatly increasing the risk of crack formation along this interface. Changing the SR profile to a straight wall (vertical or taper cut) reduces the stress concentration at this interface. FCBGA Solder Joint Crack FM Failure mechanism (Interface strength): Presence of voiding at the Ni-P+ and Ni-Sn intermetallic interface results in a decrease in the strength of the solder ball joint. The higher the density of these voids, the lower the strength o