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aroadmapandvisionforphysicaldesignispd-2002april
A Roadmap and Vision for Physical DesignISPD-2002April 9, 2002Andrew B. Kahng, UCSD CSE ECE Departmentsemail: abk@URL: Outline What we need ITRS challenges, logical/circuit/physical needs SRC needs What we do Allocation of effort, versus needs and resources Harmful practices What we need to do Coopetition Shared red bricks What we need to do, II A top-10 list The “Red Brick Wall” - 2001 vs. 1999 An ITRS Analogy ITRS is like a car Before, two drivers (husband = MPU, wife = DRAM) The drivers looked mostly in the rear-view mirror (destination = “Moore’s Law”) Many passengers in the car (ASIC, SOC, Analog, Mobile, Low-Power, Networking/Wireless, …) wanted to go different places This year: Some passengers became drivers All drivers explain more clearly where they are going See the new “System Drivers” Chapter of the ITRS Silicon Complexity Challenges Impact of process scaling, new materials, new device/interconnect architectures Non-ideal scaling (leakage, power management, circuit/device innovation, current delivery) Coupled high-frequency devices and interconnects (signal integrity analysis and management) Manufacturing variability (library characterization, analog and digital circuit performance, error-tolerant design, layout reusability, static performance verification methodology/tools) Scaling of global interconnect performance (communication, synchronization) Decreased reliability (SEU, gate insulator tunneling and breakdown, joule heating and electromigration) Complexity of manufacturing handoff (reticle enhancement and mask writing/inspection flow, manufacturing NRE cost) System Complexity Challenges Exponentially increasing transistor counts, with increased diversity (mixed-signal SOC, …) Reuse (hierarchical design support, heterogeneous SOC integration, reuse of verification/test/IP) Verification and test (specification capture, design for verifiability, verification reuse, system-level and software verification, AMS self-test, noise-delay
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