W-Cu-W合金薄膜的矿床及其结构毕业论文外文文献翻译及原文.doc

W-Cu-W合金薄膜的矿床及其结构毕业论文外文文献翻译及原文.doc

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毕 业 设 计(论文) 外 文 文 献 翻 译 文献、资料题目:溅射磁控管W-Cu-W合金薄膜的矿床及其结构 文献、资料来源: 文献、资料发表(出版)日期: 院 (部): 专 业: 班 级: 姓 名: 学 号: 指导教师: 翻译日期: 2017.02.14 Deposition and structure of W–Cu multilayer coatings by magnetron sputtering CWang1,4, P Brault1,5, C Zaepffel1, J Thiault1, A Pineau2 and T Sauvage3 1 Groupe de Recherches sur l’Energ′etique des Milieux Ionis′es, UMR6606 CNRS-Universit′e d’Orl′eans BP 6744, 45067 Orl′eans Cedex 2, France 2 Centre de Recherches sur la Mati`ere Divis′ee, 1B rue de la F′erollerie, F-45071 Orl′eans Cedex 2, France 3 Centre d’Etudes et de Recherches par Irradiation, UPR33 CNRS, 3A Avenue de la Recherche Scientifique, 45071 Orl′eans Cedex 2, France E-mail: Pascal.Brault@univ-orleans.fr Received 22 July 2003 Published 15 October 2003 Online at stacks.iop.org/JPhysD/36/2709 Abstract W–Cu–W multilayer metallic coatings are designed and deposited by dc magnetron sputtering on an Fe substrate. Correlations between the deposition parameters, such as target power and Ar gas pressure, and the film characteristics are investigated. Especially, deposition parameters for a dense W–Cu multilayer coating are discussed. The coatings exhibit small grain sizes and a dense surface structure for high target power and low argon pressure, leading to dense and well adhesive films. 1. Introduction Tungsten, as a high-atomic number (high-Z) and refractorymaterial, has attracted considerable interest for its potential use in the ITER plasma-facing components and in microelectronic technology due to its excellent thermal and electrical properties [1–3]. In addition, tungsten-based coatings have been developed for applications in the field of wearor erosion-resistant components in high-temperature/highvacuum environments, for exampleW–C,W–Si,W–N,W–Re, W–La2O3 [4–7]. On the other hand, due to the very high thermal conductivity and fracture toughness, Cu and its alloys have been widely used as heat sinks in high-heat flux plasmafacing components. SoW–Cu

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