chapitre7.ppt

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chapitre7.ppt

Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Trends in Microelectronic Systems Integration for Photonics Sensing Technology (2) Plane Array of n?m elements APAP realized by III-V semiconductor FPA, APS and MAPS realized by standard silicon process Each element: Sensing devices Analogue signal processing Digital controls (Analogue-digital conversion) Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Analog Signal Processing Pre-amplification and signal conditioning Low-noise tolerance High gain High speed or large bandwidth Good linearity Low power consumption Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Digital Controls Reset systems Analogue-digital conversion Different output forms: Series: readout speed is slow. Parallel: readout speed is fast and architecture is complex. Series- parallel Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Optimisation of System Noise sources: KTC noise FPN (Fixed Pattern Noise) CDS (Correlated Double Samples) correction Analog-digital conversion in pixel Anti-parasitic Eliminating zero in order to increase transmission speed Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Operation Conditions Radiation environment: Charged particles (protons electrons etc.) Neutral particles (neutrons, photons, etc.) High temperature operation Cryogenic operating 77 K (-196°C) 4,2 K (-269°C) Harbin Institute of Technology, China Prof. Y. HU Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Future of CMOS Technology How far can we push Si transistor? Harbin Institute of Technology, China Prof. Y. HU * July, 2014 ??Mainstream?? Chip Technology Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Moore’s Law Continues Harbin Institute of Technology, China Prof. Y. HU * July, 2014 Scaling Red

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