OperationinDipsection.docVIP

Operation in Dip section DIP section is to mount the larger components than those smaller ones in SMT section onto PCBA board by wave soldering. All actions of operators must comply with SOP. SOP is issued by IE department, the layout of PCBA board is showed on SOP and positions for different components are marked with different colors. And items of part code, part name spec, part location quantity are also listed on SOP. Every operator has one skill card. And all the training he/she has received is stated there. Thus they will be assigned different jobs according to it. 插件段是要把比在SMT段大一點的零件通過波動焊接粘著在板子上.操作工所有的動作都要遵循標準操作書進行.標準操作書是由IE部門 製作的.PCBA 板子的平面圖畫在紙上,不同零件的位置用不同顏色標註.零件代碼,名稱規格和數量也列在紙上.每個操作工都有一張技能卡,上面列有其所接受的培訓,根據這個來分配其做不同的工作. Cutting board insert components 裁板,插件 Jointed PCBA boards are cut into single board by V-utter put into DIP fixture separately. Follow on is to insert the components. As for ESD protection, we have two ionizing blower on each production line. Meantime, every operator must wear ESD gloves wrist strap. After all components have been inserted, each PCBA board is fixed tightly to prevent the components from moving when passing through the wave solder. PCBA 聯板用切割機切成單板然後分別放到制具中.接下來是把零件插到板子上.關與靜電防護方面,我們在每條線上設2台離子風扇.同時,每個操作工必須戴靜電手套和手環. 所有零件插完後, 每塊板子用擋板制具夾緊防止在通過大錫爐的時候零件移動. 2.Pass the wave solder: 過大錫爐; On this section, speed of the conveyor temperature of wave solder will be controlled strictly. The wave solder is cleaned once a week. 在這一站,傳送帶的速度和錫波的溫度會被嚴格控制.大錫爐每週清理一次. 3.Out of wave solder: 出大錫爐; 3.1.Uploading fixture 卸夾具 Here we upload the fixture and put the boards carefully on the conveyor. The side with large components should be placed upwardly. Following are series of touch-up. 這裡我們卸下制具,小心把板子放到傳送帶上.有大零件的一面朝上放.接下來是一系列修整. 3.2.Cutting feet 剪腳 First of all, operator cuts off the unnecessary feet that out of PCBA board. Then the touch-up finished PCBA boards are put in reverse in order to distinguish with the untouched up ones. 首先,操作工把高出板子