Underfill 维修指南.pptVIP

Rework Process Remove solder and underfill residue Rework Guidelines 准备工作/Equipments needed： 加热装置(维修工作台/热风枪) Heating Equipment(Rework Station/Hotair gun) 头部楔形的小木棍/牙签 Small wood stick with cuspidal end or toothpick 助焊剂/Flux 棉签/Cotton stick 尖头镊子/Nipper with cuspidal end 吸锡带/焊锡丝/Solder wick and solder wire 若有可能的话加上显微镜/Microscope if possible Rework Guidelines — Remove the adhesive around the BGA (fillet) 加热/Heating： 设置热风枪温度到150C热风枪加热PCB板的BGA区域 Set the temp to 150C, then heating the BGA area of the PCB with hot air gun 若用维修工作台可设置温度值在150C 150C temperature setup is suggestion if use rework station 温度不要超过焊球熔点 Never exceed the solder ball melting point 原因/Why： underfill在加热到100C左右时会变得较软，容易去除 It’s easy to remove softened underfill above 100C 超过焊球熔点后，去胶时易把周边小元件碰掉 Too high temperature may cause small component around BGA be removed; Rework Guidelines — Remove the adhesive around the BGA (fillet) 去周边胶/remove the underfill around the BGA： 在基板底部使用热风，加热至100C左右,在此状态下可使用尖锐木制工具（如牙签等）去除元器件周围的胶粘剂。 Heating PCB to 100C-150C, remove underfill around the BGA with wood stick (eg. Toothpick) 在此状态下，焊锡尚未熔化，不会影响周边靠得较近的元件 Small component around BGA will never be removed because the temperature is lower than the melting point 或者使用带温度的尖头烙铁直接去除芯片周边的胶（这需要较熟练的维修人员） Or you can remove the underfill around BGA with cuspidal iron tip directly (this operation only for the professional rework operator ) 原因： 分离芯片与周边器件的胶连接 Divide the BGA from the components around it 保证芯片能被轻松卸下而不损及周边器件及PCB板 To be insured that the BGA will be removed without damage to the component around it. Rework Guidelines -- Remove the BGA 加热/Heating： 调整热风枪加热温度至BGA焊球熔点以上（如350C） Adjust the hot air gun’s heating temperature to above the melting point of solder joint（eg.350C) 保持一定时间以保证焊球熔化，不要加热太长时间（正常小于1分钟） Keep some time to melt the solder ball, but too long time is not suggested 维修工作台可以设置温度曲线（具体要根据实际相应调整） You can setup a profile if use rework station according to the test result 在保证焊球熔化的前提下温度尽可能低点 Set low enough