杜邦产品介绍..pptVIP

Introduction to Flexible Circuit Materials Presented by: Jonathan C. Li 簡報大綱 軟性電路板基材之介紹 基材的主要Composition Dielectric Substrates (絕緣體) Adhesive (膠質) Conductor (導體) 簡報大綱 (continue) 杜邦產品 壓克力膠系列(Modified WA Acrylic)之基材 環亞樹脂膠系列(Modified Epoxy)之基材 杜邦 料號解說 Pyralux? Telcam? 軟性電路板之主要基材 Copper Clad Laminates (銅箔基材) Single-Sided C.C.L.(單面銅箔基材) 軟性電路板之主要基材 Double-Sided C.C.L. .(雙面銅箔基材) 軟性電路板之主要基材 Adhesive-Less C.C.L. .(無膠銅箔基材) 軟性電路板之主要基材 Coverlay(覆蓋膜) 軟性電路板之主要基材 Stiffner (補強材) 軟性電路板之主要基材 Bondply 軟性電路板之主要基材 Sheet Adhesive PhotoImageable Coverlay (PIC) Dry Film Fine-Line Application Camera Automotive Others Dielectric Substrates Definition A base film on which the printed conductors are laid. A film which provides electrical insulation between conductors. A film which provides mechanical strength of the circuit. Dielectric Substrates 必備之特性 Mechanical Strength Flexibility Dimensional Stability Dielectric Properties Thermal Properties Chemical Resistance Moisture Absorption Cost Dielectric Substrates Substrates 之種類 Polyimide Polyester Fluorocarbon Aramid Paper Composite Substrates Polyimide: Popularized by DuPont under “Kapton” Also known as PI First choice of film in most FPC Infusible and flame retardant High Tg (約 260C - 280C) Good dimensional stability Substrates Polyester: Popularized by DuPont under “Mylar” Also known as PET Lowest cost dielectric material Mostly used in low-cost consumer application Good mechanical properties Bad thermal properties Substrates Aramid Paper: Sold under DuPont trade name “Nomex” Used in specialized application Good thermal insulation material Dielectric Substrates Adhesive Definition Material that bonds layers together Thermosetting Thermoplastic Adhesive 必備之特性 Adhesion Strength Flexibility Chemical Resistance Thermal Resistance Moisture Absorption Electrical Properties Cost Adhesive Adhesive之種類 Polyester Acrylic Epoxy Polyimide Butyral Phenolic Adhesive Polyester: Used where the dielectric is also polyester Used where no soldering