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塑膠電鍍介紹 Plating on Plastics * * 塑膠電鍍介紹 Plating on Plastics 塑膠電鍍原理及注意事項Principles of Plating on Plastic 第一站 素材選擇 ABS塑料案例 (Step 1:Selecting Material ABS Plastic Case) 1.最好採用電鍍級ABS塑膠如圖所示其丁二烯含量15%~16%密著強度最好 Selects the ABS plastics showing on the right which the butadiene is 15%-16%.Its adhesion is best. 2.采用70%~95%PC+ABS材料要請供應商提供防火材料%、PC%、等相關資料 Applier should offer fireproof material, PC%,etc,and references before selecting 70%-95%PC+ABS. 3.塑膠電鍍原料應完全乾燥(含水率0.1%以下) Materials of plating on plastic should be dried totally. 4.塑膠電鍍原料盡量避免染色Materials of plating on plastic must prevent dyeing. 5.塑膠電鍍原料UL認證 Materials of plating on plastic should be attested by UL. 0.5 1.5 2.0 2.5 3.0 3.5 4.0 4..5 1.0 14 19 15 16 17 18 密著強度 Kgf/cm 丁二烯　ｗt % 各材質丁二烯之含量 塑膠電鍍介紹 Plating on Plastics 塑膠電鍍原理及注意事項 第二站 模具設計 Step2:Mould Design 1.塑膠電鍍模具必須預留電鍍夾具掛架點(以防產品變形及生產便利性) Remains points for electroplating rack in mould of plating on plastic . 2.模具設計趨向：耐高溫不易頂開產生毛邊、射出點不可太細以防入水斷裂脫 落、預防尖端放電(加框)、注意離模斜度、預留排氣孔、注意頂針粗細影響外觀及進膠口位置產生之結合線等Trend of moulds design: Moulds should of be resistant to high temperature and not easily open to create crude outline, the ejection point should not be too small to prevent entering water and breaking. Prevents discharge of tip. Reminds the ventilator. Pays attention to that thickness of tip will influence the exterior and the combination line created in the ejection hole. 5.模具需預留電鍍後膜厚及組裝間隙 Remain the thickness of membrane which formed after electroplating. 3.塑膠電鍍模具成型盡量避免尖端設計，盡可能改為R角 Adopts round corner instead of tip corner in mould design. 4.模具孔洞盡量設計導通，預防殘留藥水不易清洗 Designs passage in the hole to clean the remnants. 塑膠電鍍介紹 Plating on Plastics 塑膠電鍍介紹 Plating on Plastics 塑膠電鍍原理及注意事項 第三站 成型射出 Formation and Ejection 5.尺寸確認：依廠商訂定長寬尺寸、範圍Affirming the size:decides the size and range of lenth and width according to the requirement of the firm. 2.射出參數在不頂模、不起毛邊狀況下，盡可能拉高樹脂溶解溫度及模溫溫度，降低射出壓力及射出速度，以減少應力產生The ejection parameter such as plastic Tm and mould tem