(英文)溅射原理和应用.pptVIP

Advanced Magnetron Sputtering Techniques: Principles and Applications Original Ion Plating Ion bombardment can replace the effect of temperature and provide enhanced diffusion (Mattox, 1963) Adhesion Throwing Power Densification Requirements Ion Energy - about 40 eV Ion Current - high 1mA/cm2 Ion Plating Characteristics Practical Ion Plating Systems Evolution ofMagnetron Sputtering Techniques Conventional Magnetron Increased Ion Current Ion Current Characteristics Main Advantages of CFUBMSIP Stability Repeatability Uniformity Low Temperature Flexibility Compounds Alloys Graded