湿度敏感元件保存和烘烤作业规范(国外英文资料).docVIP

湿度敏感元件保存和烘烤作业规范(国外英文资料) Standard Practice for preservation and baking of moisture sensitive elements 1 Purpose Specify all humidity sensitive components (HSC) control and management procedures to ensure smooth production. Ensure that moisture sensitive components are effectively protected and controlled to prevent component damage and affect product quality. 2 scope of application 2.1 applies to all moisture sensitive components of USTs SMT installation, except humidity sensitive components of 2a-5a components, manual welding and wave soldering. 2.2 apply to UST company for all products on the humidity sensitive components of baking and storage operations. 2.3 A SMT module (MODULE) with a moisture sensitive element. 3 applicable documents 3.1 IPC/JEDEC J-STD-020 3.2 IPC/JEDEC J-STD-033 4 equipment and materials 4.1 oven 4.2 vacuum packaging machine 4.3 HSC time control tab 4.4 damp proof cabinet 5 main results and key parameters 5.1 SMT components are sealed packaged in storage conditions: the temperature is less than 40 degrees; the humidity is less than 90%RH, the stock time is 12 months. 5.2 reference workshop environment requirements: temperature less than 30 DEG C; humidity is less than 60%RH; when the workshop environment beyond, service life is reduced unpacking level implementation. 5.3 using the seal of life: moisture sensitive components removed vacuum packaging into the reflow time between. 6 Security 6.1, in the process of dealing with humidity sensitive components, to do electrostatic protection. 6.2 be careful when baking and vacuum packaging to prevent deformation of the components feet. 6.3 before baking, make sure the components, packaging materials (tape, tray) can withstand the temperature, and then set the baking temperature and baking time according to the corresponding temperature. 6.4 lead and lead free materials need to be stored separately and baked 7 procedures and responsibilities The baking condition 7.1 humidity sensitive element and us