CdZnTe表面处理对其引线超声焊接质量的影响-材料工程.PDF

Cd nTe 9 CdZnTe Influence of Surface Treatment T echnology on the Ultrasonic Welding Property Betw een the Dow n-lead and Au Electrode of Cd nT e Wafer , , , ( , 710072) NIE hong- ming, FU Li, REN Jie, XU Chong ( State Key Laboratory of Solidification Processing, N orthwestern Polytechnical U niversity, Xian 710072, China) : EDS Cd nTe , Cd nTe , Cd nTe , ; Cd nTe , 180nm C T , 2W 60 10- 3 kg20ms 1.5W , Cd nTe : Cd nTe ; ; ; : TB34 : A : 1001-4381( 2008) 09-0009-04 Abstract: By means of scanning electron microscope and EDS test, the factors which have a great in- fluence on the ultrasonic wire bonding between the Cd nTe( C T ) electrode and the Au down-lead are studied, such as surface treatment technology, electrode thickness of C T wafer and ultrasonic weld- ing parameters. The results show that C T wafer with the mechanical polishing treatment was easier to achieve the ultrasonic wire bonding between the Au electrode of C T and the down- lead. Moreo- ver, the weldbility between the C T electrode thickness and the down-lead show s a kind of parabola relationship. T hats to say, there should be an optimal C T electrode thickness ( 180nm in this re- search) for the high bonding rate when the electrode treatment technology had been fixed up. Besides, the welding power and the wedge pressure influence the ultrasonic wire bonding rate greatly. In this - 3 test, the optimal welding parameters were as follow s: the power 2W, the pressure 60 10 kg, weld-