智能手机基带芯片的可靠性测试与失效分析.pdfVIP

摘 要 可靠性是智能手机基带芯片产品质量的重要衡量指标之一，也是产品走向市场后 是否能够具备足够的市场竞争力的前提。可靠性测试作为集成电路产品质量相关的重 要测试方法，这项新兴学科越发得到企业和用户的高度关注。集成电路技术的快速发 展，带动了智能手机芯片市场发展，需要面对更多挑战，智能手机基带芯片特征尺寸 的不断减小也对产品的可靠性有了越来越高的需求，而产品质量不能仅仅依靠单纯的 测试来淘汰不良品，这无法满足对产品质量的整体把控和提升，因此，失效分析学科 应运而生。产品发生失效常常连带降低整个型号产品的良率，给企业带来损失，失效 分析是能够从根本上分析出症结所在，同时杜绝类似失效持续产生的最佳手段。在基 带芯片产品可靠性测试基础上运用失效分析手段追溯失效根源，可以有效的将产品良 率提高。 本文以国产主流智能手机基带芯片产品为样本，从可靠性测试流程设计、测试条 件把控、测试结果分析、失效分析等方面对智能手机基带芯片的后端质量进行分析。 针对智能手机基带芯片产品的生命周期建立可靠性数学模型，提出早期失效率的计算 方法，并对早期失效率的计算准确性提出优化方案；基于可靠性测试标准制定测试取 样模式，制定符合生产实际的可靠性测试流程及测试条件，提取失效样本；针对失效 芯片及相应批次产品进行数据失效分析、电性失效分析及物理失效分析，定位失效位 置与失效机理，从而提出可行性产品良率提升建议。 关键字：智能手机 基带芯片 可靠性测试 失效分析 ABSTRACT Reliability is an important quality measurement of the smartphone baseband chip products; meanwhile, reliability is the premise for the competitiveness of a product when it is ready to be put into the market. As an important method related in quality control of integrated circuits products, reliability test, this new branch of science gets more and more attentions from the enterprises and customers. As the integrated circuits industry rapidly developing, led to a significant development in the smartphone chip market, more challenges has shown up at the same time. The feature size of the smartphone baseband chip products keep decreasing led to a higher demand of the reliability, the product quality can not only rely on simply eliminating the defective ones by regular tests, which can not meet the overall quality control and product improvement, therefore, failure analysis rises in response to the proper time and conditions. A significant failure always coming up with a low yield of the whole production line, which brings loss for the enterprise, failure analysis is the