化学机械研磨举动と表面生成物の物性との相关性 - j-stage journals.pdfVIP

252 表面技術 技術論文 化学機械研磨挙動と表面生成物の物性との相関性 a* a b b 馬渕　勝美 ，本棒　享子 ，天野倉　仁 ，小野　　裕 a ㈱日立製作所 日立研究所（〒319︲1292　茨城県日立市大みか町7︲1︲1） b 日立化成工業㈱新事業本部（〒317︲8555　茨城県日立市東町4︲13︲1） Correlativity with Properties of Surface Products and Chemical Mechanical Polishing Behavior a* a b b Katsumi MABUCHI , Kyoko HONBO , Jin AMANOKURA and Hiroshi ONO a Hitachi Research Laboratory, Hitachi Ltd.(7-1-1, Omika-cho, Hitachi-shi, Ibaraki 319-1292) b Advanced Performance Materials Operational Headquarters, Hitachi Chemical Co., Ltd.(4-1-3, Higashi-cho, Hitachi-shi, Ibaraki 317-8555) Correlation between the physical and chemical properties of the reaction products and dissolution behavior of copper in Cu-CMP slurry containing hydrogen peroxide was studied. The solubility behavior of the copper was evaluated for corrosion current density using Tafel plots with a rotating electrode that had an original load addition function. The physical and chemical properties of the product were evalu- ated using AES, XPS, and a nanoindenter. Numerous reaction products with low hardness were generated under the condition with a large corrosion current density under the load. With high corrosion current density, the reaction products consisted of Cu and the additives as the main constituents. In contrast, when the corrosion current density was low, copper oxide predominated. These results indicate that control- ling the oxide generation rate and the reactive generation rate of the additive is important for increasing the rate and enabling both to coexist smoothly. Regarding enabling