切削在精度上超越抛光（The cutting is more accurate than polished）.docVIP

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切削在精度上超越抛光（The cutting is more accurate than polished）.doc

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切削在精度上超越抛光（The cutting is more accurate than polished）

切削在精度上超越抛光（The cutting is more accurate than polished） To make the cutting more accurate than polished With the progress of cutting technology, the precision machining has changed greatly (figure 1). Even in the nanoscale shapes and surface roughness of machining processing, smaller than 0.1 mu m (100 nm) of the ultra precision machining is possible, as shown in figure 2 mirror processing has become a reality * 1. This accuracy is not achieved after the cutting process has been polished. Compared with polishing, the smooth surface is more achieved by cutting. Common sense is being overturned. Figure 1: precision of ultra-micro precision machining The average machining center (MC) has a precision of about 10 mu m, and the MC, which is more sophisticated than 100nm, has also been made. Figure 2: an example of machining the surface that can reflect the reflection By Sodick. (a) for the cutting example of a hemispherical surface with a radius of 2mm, the material is a stainless steel type of STAVAX (HRC54), and the processing time is 40 minutes for each pit. According to the order of (), (), (), () () (). The machine USES AZ150 and the surface roughness Ra is 7 ~ 8nm. (b) for the plane cutting example, the material is equivalent to the mold steel SKD11 (HRC60), and the surface roughness Ra is 6.0 nm. * 1 definition of surface roughness includes arithmetic mean accuracy Ra and maximum height Ry. The results of the determination of the concave of a certain segment interval (the reference length l) were calculated. The unit is mm, mu m, etc. (length). Ra is the value of the absolute value of the average height of the peak valley divided by l. The height difference between the highest peak and the lowest point (valley). Pv is the largest valley in which large fluctuations are taken into account. Precision processing is recognized as a technology that is needed for miniaturization, high functionalization and energy conservation in the fields of electronics, light, energy and