双面板制作简介.pptVIP

U P 17.包裝(Packing Shipping) Vendor :Uniflex-ks Handle with Care P/N: 82IH49228AA Quantity : 1000pcs * * Etch resist is applied defining the circuit and the protecting holes * Etch resist is applied defining the circuit and the protecting holes * Circuit pattern is etched in copper foil * Etch resist is stripped from the circuit * Repunched coverlayer is laminated to the circuits * Repunched coverlayer is laminated to the circuits * Repunched coverlayer is laminated to the circuits. (Tack coverlayer to flex circuit) * Repunched coverlayer is laminated to the circuits. (Tack coverlayer to flex circuit) * Remove protective MYLAR by MYLAR peeler and develop using a special processor. * Remove protective MYLAR by MYLAR peeler and develop using a special processor. PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron PAGE: * World Class Quality CONFIDENTIAL Unimicron 雙面軟性印刷電路板生產流程 雙面板疊構 (Double side Structure) PI AD(Adhesive) CVL Adhesive CVL (Coverlay) Surface Finish Double Side FCCL (with Adhesive) Copper Foil 0.發料 (Base Material Cut to Size) Raw Material : PI or PET 250 or 500 mm Sheet Size 1.下料裁板 (Material Issue) Working Panel Size 2.鑽孔或沖孔(Holes are drilled or punch into the laminate) 鑽孔機 3.黑孔及電鍍 (Holes and surface are plated with Copper) 上掛架 4.線路製作:壓乾膜 (Dry Film Lamination) Laminate D/F UV光源 UV光源 5.線路製作:曝光 ( Exposure) 平行曝光機 6.線路製作:曝光後 ( After Exposure) 7.線路製作:顯影 (Develop) Developing 8.線路製作:線路蝕刻