5.1 Cryogenic system design - USPAS（5.1低温系统设计USPAS）.pdf

5.1 Cryogenic system design   Low temperature environment Refrig. Thigh Thermal   Source of refrigeration Insulation   Heat exchange medium Heat I C T   Thermal insulation low Load   Structural support   Instrumentation and control Structural support USPAS Short course Boston, MA 6/14 to 6/18/2010 1 Thermal Insulation Systems   Solid foam insulation   Powder insulation   Vacuum   Radiation heat transfer   Gas conduction/convection   Multi-layer insulation   Radiation shields (active and passive)   MLI USPAS Short course Boston, MA 6/14 to 6/18/2010 2 Solid Foam Insulations   Solid foam insulations are not used very often in cryogenics because they have relatively poor performance   Since these materials are typically gas filled, their thermal conductivity is kair ~ 25 mW/m K. Example: Consider a Polystyrene LN2 vessel with 20 mm wall and 1 m2 surface area. Heat leak: Q = kAΔT/L 2 = 33 mW/m K x 1 m x (300 – 77)