国产晶硅平板pecvd设备的优势（Advantages of domestic silicon wafer pecvd equipment）.doc

国产晶硅平板pecvd设备的优势（Advantages of domestic silicon wafer pecvd equipment） PDF documents may have a poor browsing experience at the WAP end. It is recommended that you choose TXT, or download the source file to the native view. Advantages of domestic silicon wafer PECVD equipment Dr. Wang baoquan May 2010 SNEC Booth location: W2 pavilion T2136 The technological advantage of silicon wafer PECVD equipment is the competitive advantage of the opportunity ESSINDTM PECVD device in the northern microelectronic development of the tablet PECVD equipment confidential The technological advantage of silicon wafer PECVD equipment is the competitive advantage of the opportunity ESSINDTM PECVD device in the northern microelectronic development of the tablet PECVD equipment confidential The application of PECVD equipment in silicon solar cell manufacturing process PECVD (plasma enhanced chemical vapor deposition) technique is the use of plasma characteristics to control or influence gas instead With chemical reaction process on the surface of the material, and in the appropriate temperature (from room temperature to 500 ℃) under the deposition film. Crystalline silicon solar cell process The pretreatment of PECVD sintered electrode printing was spread The PECVD equipment is used to prepare the SiNx film The characteristics of sine attenuation are prepared by passivation characteristic confidential Short circuit current battery efficiency open circuit voltage PECVD device category The device structure is divided Plate tube type The principle of sedimentation is divided Direct method Plasma Source SiH4, NH3 Plane loading board Hollow carbon box The graphite boat Plane loading board The graphite boat The function is distributed in different chamber gas utilization high automation degree high production efficiency high automatic loading and unloading sheet easy to realize equipment maintenance tedious The function is concentrated in the same furnace tube gas utilization low automation degr