Effect of Solder Volume on joint shape with （焊锡量对接头形状的影响）.pdfVIP

Effect of Solder Volume on joint shape with variable chip-to-board contact pad ratio. Pio Jesudoss1), Alan Mathewson1), William Wright2), Brendan O’ Flynn1) and Frank Stam1) 1) Microelectronics Applications Integration Tyndall National Institute, Lee Maltings, Prospect Row, Cork, Irland 2) Department of Electrical and Electronic Engineering, University College Cork, Cork, Ireland Abstract : The objective of this