smt印制电路板热设计探讨（Discussion on thermal design of SMT printed circuit board）.docVIP

下载本文档

6
0
约1.44万字
约 9页
2017-08-20 发布于河南
举报
版权申诉

smt印制电路板热设计探讨（Discussion on thermal design of SMT printed circuit board）.doc

1、本文档共9页，可阅读全部内容。
2、原创力文档（book118）网站文档一经付费（服务费），不意味着购买了该文档的版权，仅供个人/单位学习、研究之用，不得用于商业用途，未经授权，严禁复制、发行、汇编、翻译或者网络传播等，侵权必究。
3、本站所有内容均由合作方或网友上传，本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺！文档内容仅供研究参考，付费前请自行鉴别。如您付费，意味着您自己接受本站规则且自行承担风险，本站不退款、不进行额外附加服务；查看《如何避免下载的几个坑》。如果您已付费下载过本站文档，您可以点击这里二次下载。
4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等，请点击“版权申诉”（推荐），也可以打举报电话：400-050-0827(电话支持时间：9:00-18:30)。
5、该文档为VIP文档，如果想要下载，成为VIP会员后，下载免费。
6、成为VIP后，下载本文档将扣除1次下载权益。下载后，不支持退款、换文档。如有疑问请联系我们。
7、成为VIP后，您将拥有八大权益，权益包括：VIP文档下载权益、阅读免打扰、文档格式转换、高级专利检索、专属身份标志、高级客服、多端互通、版权登记。
8、VIP文档为合作方或网友上传，每下载1次，网站将根据用户上传文档的质量评分、类型等，对文档贡献者给予高额补贴、流量扶持。如果你也想贡献VIP文档。上传文档

smt印制电路板热设计探讨（Discussion on thermal design of SMT printed circuit board）

smt印制电路板热设计探讨（Discussion on thermal design of SMT printed circuit board） This article is contributed by qiuzhihua1987 Pdf documents may experience poor browsing on the WAP side. It is recommended that you first select TXT, or download the source file to the local view. Discussion on thermal design of SMT printed circuit board First, with the development of microelectronic technology, surface mount device applications have become very common, and the technology of SMT is quite mature. The high density surface mount device pin spacing is generally less than 0.5mm, the wiring density of printed circuit board is also more and more dense, generally the diameter of 0.1-0.3mm, spacing 0.2-0.3mm, will 0.05-0.1mm wire diameter and 0.1mm spacing development; multilayer board will also be developed to more than 20 layers. The increase of the assembly density of printed circuit board will inevitably increase the dissipation power per unit area and form a high concentration of heat on the printed circuit board. Individual devices and components of the increase of temperature will affect the stability and reliability of the circuit, the main hazards are as follows: 1) electronic components in a certain temperature range of the alternating thermal stress reaches a certain number of cycles, components will fail due to thermal fatigue. 2) changes in temperature cause changes in the performance of electronic devices. As the transistors current amplification varies with the temperature, it will cause the drift of the operating point, cause the instability of the system, and reduce the life and reliability of the device. 3) the temperature of the component is too high, which will lead to the deterioration of the electrical and mechanical properties of the printed board, and lead to the blackening and even burning of the printed board in serious cases. For example, the glass transition temperature of the epoxy glass fiber is 1250C, the coefficient of thermal expansion (CTE) is 13-18ppm/