千住无铅锡膏M705-GRN360-MZ技术资料.pdfVIP

High-Reliability, High-Preheat Resistance Lead-Free Solder Paste M705-GRN360-MZ For Head Pillow (BGA non-wetting) problem For Head Pillow (BGA non-wetting) problem Senju Metal Industry, Co., Ltd. M705-GRN360-MZ Spec TC-P100-1.1E May..2006 Pb M705-GRN360-MZ M705-GRN360-MZ is eco-friendly solder paste that provides cream solder with high- temperature preheat resistance while maintaining the high printability of our former paste, GRN360-L60. This new paste mitigates problems involving defective solder fusion between solder balls and paste that have been experienced when BGA/CSP devices are mounted. The use of BGA/CSP devices has recently been expanding, mainly in digital products. Defective Fusion of BGA Bumps is: Defective Fusion of BGA Bumps is: • A phenomenon where molten solder pieces are not fused together due to insufficient wetting. The number of such problems is increasing as Pb-free solder becomes more and more widely used. • Though there is no metallic reaction, electrical continuity is created in some cases, making it difficult to detect this problem electrically. • Visual inspection is only effective for checking the periphery of the bumps. A large-scale inspection such as substrate tilting observation by X-ray is required to nondestructively check the internal conditions of the bumps. An idea for defective bump fusion preventive measures on solder paste side based on diversified fusion mechanism analyses ! P Potential risk + variation SMT p