用于圆片级封装的金凸点研制（Development of gold bumps for wafer level packaging）.doc

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用于圆片级封装的金凸点研制（Development of gold bumps for wafer level packaging）.doc

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用于圆片级封装的金凸点研制（Development of gold bumps for wafer level packaging）

用于圆片级封装的金凸点研制（Development of gold bumps for wafer level packaging） Development of gold bumps for wafer level packaging [2004-8-17] Wang Shuidi, Cai Jian, Tan Zhimin, Hu Tao, Guo Jianghua, Jia Songliang Abstract: This paper introduces the process of making gold bumps in wafer level packaging by electroplating, and studies the main technological factors that affect the forming process of bump. Under bump metallization (UBM Under, bump metallization) sputtering, thick photoresist and thick gold plating process is a difficult one, through a large number of experiments, to determine the TiW/Au UBM system, the thick film photolithography process optimization. At the same time, a vertical spray coating device has been developed for the fabrication of gold bumps in wafer level packages. The plating parameters have been controlled and studied by using different electroplating liquid systems and photoresist systems. A comparison is made between the gold bumps produced and the basic characteristics of similar products abroad, indicating that the gold bumps have reached the applicable level. 1 Preface In the last five years, the two industries, flat panel display and portable electronic products, have developed rapidly. Mobile phones, electronic dictionaries, PDA, digital cameras and other electronic products, as small and exquisite, multi-functional and easy to use, has become an indispensable product of modern peoples daily life. Since large flat panel displays have the advantages of light, thin, non radiation and high resolution, and are gradually replacing traditional television and monitors, IDCs analysis of the LCD market illustrates this point, as shown in table 1. Whether its a small cell phone display or a large LCD monitor, you need drive chips, one or two fewer, and more than a dozen. LCD driver is characterized by small chip area, generally 20 ~ 30mm2 or so, but it has a large number of I/O ends, about 200~300 or more. As shown in Figure 1, a LCD drive with a core a