THERMOMECHANICAL SIMULATION AND （热机的模拟和）.pdfVIP

As originally published in the SMTA International Conference Proceedings. THERMO-MECHANICAL SIMULATION AND OPTIMIZATION ANALYSIS FOR WARINDUCED PBGA SOLDER JOINT FAILURES Caiying He, Ph.D., Zuyao Liu, Hongxia Wang, Lei Wang, Feng Lu, Ph.D., and Hongfeng Ran Kaifa Technology Shenzhen, Guangdong, P. R. China caiyinghe@kaifa.cn and zuyaoliu@kaifa.cn ABSTRACT often shows warpage when it is cooled down to room In SMT assembly process, the thermal warpage becomes temperature after molding due to the CTE (Coefficient of one of the root causes of solder joint reliability failures for Thermal Expansion) mismatch between the substrate and PBGA. The accurate prediction for warpage of PBGA and the EMC. The package warpage leads to reliability PCB is an important and challenging task of numerical deterioration of the connection between the circuit board simulation of PBGA solder joint defect. In this paper, the and the solder bumps. As an example of typical package numerical analysis of warpage in PBGA and PCBA is level material for thermo-mechanical performance study, carried out in consideration of the residual stresses PBGA is chosen for Finite Element Analysis (FEA) produced during SMT reflow process. The analysis modeling to understand the warpage and residue stress methodology using a viscoelastic based material model is after reflow in this paper. PBGA manufacturers and adopted to account th