【2017年整理】Sn_Bi无铅焊料的研究.pdfVIP

: Sn-Bi Sn-Bi 无铅焊料的研究 1 1 2 胡 丽 , 曾 明, 沈保罗 ( 1. 610039; 2. 610065) : 通过总结传统 Sn-Pb 焊料的特点和研制无铅焊料的条件, 综述 Sn-Bi 无铅焊料低熔点等优点 及脆性大易偏 析的缺点,分析添加In, Ag, Al, Sb 等微量合金元素对Sn-Bi 无铅焊料微观组织及性能的影响, 提出了此合金系焊料的抗蠕变 性导电性润湿性拉伸性能等尚待完善的性能及可采用合金化开发新型焊剂等新方法使Sn-Bi 焊料成为理想的无铅焊 料, 为无铅焊料的进一步研究提供 一定的参考 :Sn-Bi 无铅焊料; 合金元素; 组织性能; 合金化 :T G425 :A : 1004-373X(2009) 16- 164-03 Research of Sn-Bi Lead-f ree Solder 1 1 2 H U i ,ZENG M ing , SHEN Baoluo ( 1. College of M aterials Science and Engineering, Xihua University, Chengdu, 610039,China; 2.College of Materials Science and Engineering,Sichuan University, Chengdu, 610065,China) Abstract: By summarizing up the characteristics of conventional Sn-Pb solder and the conditions for the development of lead-free solder, overview ing the advantages such as low melting point and disadvant ages such as high brittleness, easy segrega- t ion of Sn-Bi lead-f ree solder, and analyzing the effects of trace alloying elements such as In,Ag,Al, Sb on the microstructure and propert ies of Sn-Bi solder.T he performance as creep resistance, conductibility, w etting, extensibility w hich yet to be per- fected of this solder and t he new methods such as alloying, exploit ing new flux which can be used so t hat make Sn- Bi solder be- come ideal lead-free solder are put forw ard.Providing reference for further study of lead-free solder. Keyw ords: Sn-Bi lead-free Solder; alloying elements; microstructure and properties; alloying Sn-Bi Sn-Sb , 0 1 , Sn-37Pb , 1