3) ACF验证方法.pdf

JK-09-E-017 2009.10 ACF Interconnect Alternative Interconnectf or Solder or Mechanical Connect Analysis Method of Bonding Technology Conductive Material Division Product Develop ment Section 3 Material Marketing Sales Dep t. Section 2 OTP PDF created with pdfFactory trial version 1) Analy sis Method of ACF Interonnect Reaction Rate, Peel Strength, Cross Section 2) Bonding Technique Bonding Condition Interpo ser 2 OTP PDF created with pdfFactory trial version Point of A CF Analy sis Conductive Particle should be compressed more Chemical Reaction Test must beyond 80% than 50% from original sphere’s diameter. Chemical Reaction Rate Cross Section Check if FPC PCB are well compressed yet not too deformed cross section.