The“BlackPad”FailureMechanism-FromBeginningtoEnd英文.pdfVIP

来自 中国最大的资料库下载 The ‘Black Pad’ Failure Mechanism – From Beginning to End Ronald A. Bulwith, Michael Trosky, Louis M. Picchione, Darlene Hug Cookson Electronics Assembly Materials Group - Alpha Metals - Technical Services Laboratory Published in ‘Global SMT Packaging Journal’ - September 2002 Abstract Electroless Nickel / Immersion Gold (ENIG) finished printed circuit boards are used extensively throughout the electronics industry in surface mount and wave soldering operations. Premature failures of Tin/Lead solder connections made to ENIG coatings that initially appear to be cosmetically sound have been frequently experienced. This study investigates the mechanisms causing these common failures and presents a model to account for them. The Electroless Nickel (EN) baths typically used to plate electronic circuit boards co- deposit Phosphorus, in various concentrations, with Nickel onto the copper pads. The model describes the build-up of an inherently weak Phosphorus rich layer at the interface between the EN and the Nickel-Tin intermetallic reaction layer as Nickel from EN layer reacts with the Tin from the solder. Investigative findings gathered from the metallographic examination of microstructures of ENIG solder connection failures, along with SEM/EDS analyses of failed connections, were used to support the hypothesized failure mechanism. Background EN deposits have proven to be extremely advantageous for use in electronic assemblies due to the many beneficial physical properties they possess. Composition uniformity, corrosion resistance, and good solderability make them very useful coatings as diffusion barriers between Copper (Cu) substrate sur