半导体制造装备.pptVIP

先进制造技术 半导体制造装备 半导体制造装备概述 芯片制造（前道） 单晶硅拉制、切片、表面处理、光刻、减薄、划片 芯片封装（后道） 测试、 滴胶、Die bonding、Wire bonding、压模 Advantage Fully automatic machines have been developed for volume production. Bonding parameters can be precisely controlled; mechanical properties of wires can be highly reproduced. Bonding speed can reach 100-125 ms per each wire interconnection (two welds and a wire loop). Most reliability problems can be eliminated with properly controlled and much improved tools (capillaries and wedges) and processes. Specific bonding tools and wires can be selected by packaging engineers to meet the requirements. Infrastructure of the technique has been comprised by large wirebonding knowledge, manufacturing people, equipment venders and materials. Flip-Chip Technology Advantages: · Smaller size: Smaller IC footprint (only about 5% of that of packaged IC e.g. quad flat pack), reduced height and weight. · Increased functionality: The use of flip chips allow an increase in the number of I/O. I/O is not limited to the perimeter of the chip as in wire bonding. An area array pad layout enables more signal, power and ground connections in less space. A flip chip can easily handle more than 400 pads. · Improved performance: Short interconnect delivers low inductance, resistance and capacitance, small electrical delays, good high frequency characteristics, thermal path from the back side of the die. · Improved reliability: Epoxy underfill in large chips ensures high reliability. Flip-chips can reduce the number connections per pin from three to one. · Improved thermal capabilities: Because flip chips are not encapsulated, the back side of the chip can be used for efficient cooling. · Low cost: Batch bumping process, cost of bumping decreases, cost reductions in the underfill-process Die Bonding History and applications of wirebonding Wirebonding is the earliest technique of device assembly, whose first result was published by Bell Laboratories in 1957. Sine then, the te