A Study of High Speed implementation fｏｒ System.pdfVIP

A Study of High Speed implementation for System on Chip on 2 layers Printed Circuit Board GOH Ban Hok Senior Staff Engineer Infineon Technologies Asia Pacific e-mail: banhok. , ini UP: ICIS2007 conference 8 Kallang sector Singapore 349282 Abstract- In today fast pace complexity of silicon design using simulation tools is discussed. In section C, actual environment, silicon is not longer a standalone device that you signal measurement and in section D, the EMI analysis of could provide to customers. the high speed SOC chip on 2 layers PCB board. Customers are now looking at a full solution with the whole PCB bill of materials besides the standard software package that should come along. With a rapidly closing market window, constantly cost saving A SOC chip design method and design challenges, traditional design methodologies can no longer met the requirement. For example, to lower the cost, 2 layers PCB design which is never come into consideration for To fulfill the 2 laeers PCB m lementation reurement, the high speed system design, it is going to com