IGBT模块功率循环寿命预测.pdf

江苏省工程热物理学会第六届学术会议 1-02 IGBT 模块功率循环寿命预测 姚二现 1 庄伟东 2 常海萍 1 (1 南京航空航天大学能源与动力学院 江苏省南京市 210015 2 南京银茂微电子制造有限公司 江苏省南京市 211200) 摘要：随着IGBT功率模块的广泛应用，其功率循环可靠性受到重视，本文介绍了模块的功率循环失 效机理，指出铝键合线剥离是模块功率循环失效的原因；基于有限元法计算了模块在功率循环过程 中的温度分布与变化，并在此基础上计算了模块的应力应变；根据应力应变数值计算结果，分别采 用应变能法和应变法等两种疲劳破坏准则预测了键合线疲劳寿命；研究表明，铝键合线根部为模块 的疲劳危险区；随着芯片热损耗的增加，芯片结温变化幅度增加，功率模块疲劳寿命急剧减小。 关键词：功率循环 铝键合线 有限元法 疲劳寿命 中图分类号：TN306 Power Cycle Fatigue Lifetime Estimation of IGBT Module a b a YAO Er-xian ZHUANG Wei-dong CHANG Hai-ping (a. College of Energy Power, NUAA, Nanjing 210015 China b. Najing SilverMicro Electronics, Ltd. Nanjing 211200 China) Abstract The power cycle reliability of IGBT Modules was paid more and more attention because of its widely used. In this paper, failure mechanism of power modules is introduced, aluminum wire bond lift-off is the reason of power cycle failure of power modules. FEA was used to investigate the temperature distribution and change of module during power cycle, and based on the result of thermal simulation, stress and strain of module is computed. According to the result of stress and strain of module, lifetime of aluminum wire bond is estimated. The results show that heel of aluminum wire bond is fatigue dangerous zone of module; with the increase of thermal dissipation of IGBT chip, the range of chip’s temperature increase, and the lifetime of power module decrease rapidly. Key Words : power cycle; Aluminum bond wire; finite element method; fatigue lifetime 的影响，并从断裂力学角度提出了应变能破 1  引言  坏准则来确定裂纹扩展方向。Koji Sasaki 与 IGBT功率模块的封装正朝着低成本、小 Naoko Iwasa[3]利用裂纹张开位移（COD）研究 尺寸、高性能以及高可靠性发展。丝键合工