《高性能处理器体系结构》工艺 应用 前沿问题和研究方向.ppt

CS258 S99 * Data communication is a basic operation among differnet components in current computer systems. For example, between cpu and memory. The data transfer time is decided by the latency time and bandwidth. Latency: Bandwidth: Client perceived latency is mainly from data transfer time. It is still challenging due to the imbalanced improvments of bandwidth and latency. * * 微处理器芯片的划代 First generation: 1971-78 Getting enough bits and transistors Second Generation: 1979-85 Becoming “real”computers Third Generation: 1985-89 Challenging the “establishment” Fourth Generation: 1990-2000 Architectural and performance leadership Next Generation: Now Architectural and power leadership 第一阶段： 半导体/ 集成电路 第二阶段 半导体/ 集成电路 + 微体系结构 第三阶段 微体系结构 主导技术 * * Pipelined Superscalar/VLIW (ILP) Parallel(TLP,DLP,MLP) Multithreaded(e.g.:SMT) Multiprocessing(e.g.:CMP) Other ? Microprocessor passed 30 years:Boosting Performance Technology * * 通用微处理器及其代表性微处理器芯片（2001） 通用 微处理器 RISC CISC Intel IA-32(x86)系列：86，286，386，486，Pentium, Pentium Pro, Pentium II, Pentium III, Pentium IV IA-64系列：Itanium，McKinley, Madison, Deerfield AMD x86系列: K5,K6, K6-2,K6-III, Athlon(K7), Duron x86-64系列: ClawHammer, SledgeHammer Motorola系列：M68x0和680x0 Digital系列：VAX Compaq/DEC Alpha系列：21064,21164,21264,21264A,21264B,21264C, 21364, 21464 SGI MIPS系列：R2000，R3000，R4000，R5/8000，R10/12000，R14000, R16000, R18000 ? HP PA-RISC系列：PA7300，PA8000，PA8500，PA8600, PA8700, PA8800, PA8900 SUN SPARC系列：SPARC，MicroSPARC，SuperSPARC UltraSPARC I, UltraSPARC II, UltraSPARC III, UltraSPARC IV, UltraSPARC V IBM/Motorola/Apple PowerPC系列：601,602, 603,603e, 604, 604e, 620, G3(740,750) Motorola/Apple PowerPC系列：G4 (7400, 7410, 7450, Max), G5(8500) IBM PowerPC/Power系列：750CX, 750CXe, G3e , Power 1, Power 2/P2SC, Power 3(630), Power 4,Power5 * * General-purpose Microprocessor Desktop applications: PowerPC Server applications 科学和工程计算:Power1, Power2, Power3 Power4 数据库和事务处理:RS64, RS64-II, RS64-III Embedded Microprocessor: focused