订单处理流程在半导体封装厂之物流资讯系统设计.pdf

訂單處理流程在半導體封裝廠 之物流資訊系統設計 Logistic Information System Design of Order Fulfillment Process in IC Packaging Companies 國 立 中 央 大 學 工業管理研究所 碩 士 論 文 研 究 生 ：曾 俊 龍 指導教授 ：高 信 培 中 華 民 國 八 十 九 年 六 月 二 十 九 日 頁數 ：56 論文名稱 ：訂單處理流程在半導體封裝廠的物流資訊系統設計 校所組別 ：國立中央大學工業管理研究所 畢業時間及提要別 ：八十八學年度第二學期碩士論文提要 研究生 ：曾俊龍 指導教授 ：高信培 博士 論文提要內容 ： In recent years, Integrated Circuit Packaging (ICP) companies in Taiwan have been incredibly thriving due to the growth of semiconductor industry, which has been considered reaching to the stage of maturity. Meanwhile, in order to meet the challenges of intense competition, globalization and gaining greater market share, most ICP companies have increased in size and complexity of business operations. For instance, when multiple-plant operation is replacing single-plant production, the distribution of products from point-of- origin to point-of-consumption has become one of the most important issues. Being perceived as the subject of Supply Chain Management (SCM), how to deliver quality products to the customer in right quantity, at the right time, and with minimum cost is the necessary capability that determines a company’s survival in today’s dynamic business environment. In other words, establishing and maintaining a robust logistic system becomes a most significant competition strategy. Therefore , to enhance logistic system of customer sa