SiC芯片器件研发及产业化建设项目环境影响报告书市局公示版.pdf

SiC芯片、器件研发及产业化建设项目 环境影响报告书 (公示版) 扬州扬杰电子科技股份有限公司 二○一五年十月 SiC芯片、器件研发及产业化建设项目环境影响报告书 SiC芯片、器件研发及产业化建设项目环境影响报告书 目 录 1 前言··························································································································7 1.1 项目由来·············································································································7 1.2 项目特点·············································································································7 1.3 环境影响评价工作程序···························································································8 1.4 本项目主要环境问题······························································································8 1.5 环境影响评价主要结论···························································································9 2 总则·························································································································10 2.1 编制依据············································································································10 2.1.1 环境保护法律、法规及规范性文件······················································································10 2.1.2 相关技术文件及参考文献······································································································14 2.1.3 项目有关文件及资料··············································································································15 2.2 评价因子与评价标 ····························································································15 2.2.1 评价因子··································································································································15 2.2.2 评价标准··············