官方说明书FAIRCHILD Assembly Guidelines for 8x8 MLP DriverMOS Packaging 数据手册.pdfVIP

/file/2689022 From ManualL ManualL collects and classifies the global product instrunction manuals to help users access anytime and anywhere, helping users make better use of products. Home: / Chinese: / This Manual: /file/2689022 AN-9037 Assembly Guidelines for 8x8 MLP DriverMOS Packaging By Dennis Lang INTRODUCTION This application note focuses on the soldering and The Fairchild 8x8 DriverMOS package is based on back end processing of the 8x8 MLP. Circuit Molded Leadless Packaging (MLP) technology. design considerations will be addressed in another This technology has been increasingly used in application note. packaging for power related products due to its low package height, excellent thermal performance BOARD MOUNTING with large thermal pads in the center of the The solder joint and pad design are the most package which solder directly to the printed wiring important factors in creating a reliable assembly. board (PWB) and allow modularity in package The pad must be designed to the proper design, single and multi-die packages are within the dimensions to allow for tolerances in PWB capability of MLP technology. fabrication and pick and place, and also to allow for proper solder fillet formation where applicable. The 8x8 DriverMOS has three large die attach MLP pack