官方说明书FAIRCHILD Using Fairchild Semiconductor Dual Cool MOSFETs 数据手册.pdfVIP

/file/2687680 From ManualL ManualL collects and classifies the global product instrunction manuals to help users access anytime and anywhere, helping users make better use of products. Home: / Chinese: / This Manual: /file/2687680 Application Note AN-9056 Using Fairchild Semiconductor Dual CoolTM MOSFETs Dennis Lang INTRODUCTION created by the bulk resistance from the doped Pursuing a strategy of power density leadership, Fairchild Semiconductor has released a new silicon area electrons flow through to get from the trench structure at the top of the wafer to the power specific packaging technology, Dual TM drain lead frame connection at the bottom. The Cool , to meet the rigors of escalating demand top and bottom surfaces of the die are plated for more improved thermal management in with solderable metal to permit solder electronics designs. This technology creates a attachment of the drain lead frame on the direct heat path from both the drain and source sides of the vertical MOSFET die structure bottom, and the sou