BGAXRay不良圖示.pptVIP

2.少錫球Missing Balls 3.錫洞Voiding 5.Pop Corning 6.冷焊Cold Solder 7.迴焊不足Insufficient Reflow 8.本體彎曲Warpage Page:* X-Ray 檢查機評估報告(1) Prepared by: AEE/Davy Chen,07-07-2002 A.功能說明 B.目前公司BGA不良狀況 C.Use-Frequency (預估) D.使用後預期效益 X-Ray檢查機評估及比較 A.功能說明 3-D High-resolution inspection 3D-View Missing balls can occur in the manufacturing process. Usually due to mishandling. Migration to neighboring pad or bond that appears unusually large due to solder mask breakdown. BGA錫球掉落、 BGA錫球遷移至隔壁緊臨區 (BGA材料不良 or SMT貼片不良造成) X-ray images, not being subject to voltage blooming, have been found to provide the most accurate determination of void size. Note that the tonal quality is good enough to see a wire through the void. 焊接點有錫洞—De-wetting (SMT製程不良、 PCB/PAD材料不良造成) 4.空焊(Non-Wetting ) 焊接點有空焊 (SMT迴焊製程不良、BGA錫球不良 、PCB-PAD不良造成) PCB-PAD不良 Solder balls in the center of the package are oversized due to delamination and compression under die area. 內層剝離 (BGA材料不良造成) *Cold solder is signified by a jagged irregular edge around the perimeter of the solder ball and is caused by in adequate wet out. Note that in this image only some of the balls show this signature. 冷焊--錫球外緣有尖銳不規則形狀 (SMT製程不良造成) Under sized ball bonds If package was misplaced the ball shape will be elliptical Bond distribution is not consistent 錫球包裝不良 (BGA材料不良造成) Note distortion of ball bonds in the lower right corner View through visual microscope. Note ball separating away from the package. BGA角部錫球變形 (BGA材料不良造成本體彎曲) Page:*