硬件英语单词.docVIP

硬件英文单词完全扫盲 基本知识BGA(Ball Grid Array，球状矩阵排列)??CMOS: Complementary Metal Oxide Semiconductor，互补金属氧化物半导体??CISC(Complex Instruction Set Computing，复杂指令集计算机)??COB(Cache on board，板上集成缓存)??COD(Cache on Die，芯片内集成缓存)??CPGA(Ceramic Pin Grid Array，陶瓷针型栅格阵列)??CPU：Center Processing Unit，中央处理器??EC(Embedded Controller，微型控制器)??FEMMS：Fast Entry/Exit Multimedia State，快速进入/退出多媒体状态??FIFO：First Input First Output，先入先出队列??FPU：Float Point Unit，浮点运算单元??HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状矩阵封装??IA：Intel Architecture，英特尔架构??ID：identify，鉴别号码??IMM: Intel Mobile Module, 英特尔移动模块??KNI(Katmai New Instructions，Katmai新指令集，即MMX2)??MMX：MultiMedia Extensions，多媒体扩展指令集??NI：Non－Intel，非英特尔??PGA: Pin-Grid Array(引脚网格阵列),耗电大??PSN(Processor Serial numbers，处理器序列号)??PIB: Processor In a Box(盒装处理器)??PPGA(Plastic Pin Grid Array，塑胶针状矩阵封装)??PQFP(Plastic Quad Flat Package)??RISC(Reduced Instruction Set Computing，精简指令集计算机) SEC: Single Edge Connector，单边连接器??SIMD：Single Instruction Multiple Data，单指令多数据流??SiO2F(Fluorided Silicon Oxide，二氧氟化硅)??SOI: Silicon-on-insulator，绝缘体硅片??SSE(Streaming SIMD Extensions，单一指令多数据流扩充)??TCP: Tape Carrier Package(薄膜封装),发热小??TLBs(Translate Look side Buffers，翻译旁视缓冲器)??VLIW(Very Long Instruction Word，超长指令字) AGP: Accelarated Graphic Port(加速图形端口),一种CPU与图形芯片的总线结构??APIC: Advanced Programmable Interrupt Controller(高级程序中断控制器)??BGA: Ball Grid Array(球状网格阵列)??BTB/C: Branch Target Buffer/Cache (分支目标缓冲)??CC: Companion Chip(同伴芯片),MediaGX系统的主板芯片组??CISC: Complex Instruction Set Computing(复杂指令结构)??CMOS: Complementary Metal Oxide Semiconductor(互补金属氧化物半导体)??CP: Ceramic Package(陶瓷封装)??CPGA: Ceramic Pin Grid Array(陶瓷针脚网格阵列)??CPU: Centerl Processing Unit(中央处理器)??DCT: Display Compression Technology(显示压缩技术)??DIB: Dual Independent Bus(双重独立总线),包括L2cache总线和PTMM(Processer??To Main Memory,CPU至主内存)总线??DP: Dual Processing(双处理器)??DX: 指包含数学协处理器的CPU??ECC: Error Check Correct(错误检查纠正)??ECRS: Entry Call Return Stack(回叫堆栈),代替RAM存储返回地址.??EPIC: Explicitly Parallel Instruction Computing(清晰平行指令计算),是一