solderability tests for printed boards(英文pdf 7).pdfVIP

J-STD-003B 3rd Working Draft February 2004 IPC/EIA J-STD-003B Solderability Tests for Printed Boards 3rd Working Draft February 2004 1 J-STD-003B 3rd Working Draft February 2004 1 GENERAL 1.1 Scope This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This standard is intended for use by both vendor and user. 1.2 Purpose The solderability determination is made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. This is determined by evaluation of the solderability specimen portion of a board or representative coupon which has been processed as part of the panel of boards and subsequently removed for testing per the method selected. 1.3 Objective The objective of the solderability test methods described in this standard is to determine the ability of printed board surface conductors, attachment lands, and plated-through holes to wet easily with solder and to withstand the rigors of the printed board assembly processes. 1.4 Performance Classes Three general classes have been established to reflect progressive increases in sophistication, functional performance requirements and testing/ inspection frequency. It should be recognized that there may be an overlap of equipment categories in different classes. The user has the responsibility to specify in the contra