半导体封装制程与设备材知识介绍-PPT.pptVIP

A Few Concepts BBD (Blade Broken Detector) Cutter-set: Contact and Optical Precision Inspection Up-Cut and Down-Cut Cut-in and Cut-remain 晶 圓 切 割 (Dicing) Dicing 相关工艺 A Die Chipping 芯片崩角 B Die Corrosive 芯片腐蚀 C Die Flying 芯片飞片 Wmax , Wmin , Lmax , DDY ,DY 規格— DY 0.008mm Wmax 0.070mm Wmin 0.8*刀厚 Lmax 0.035 ??????? 切割時之轉速予切速: a.?????? 轉速 : 指的是切割刀自身的轉速 b.????? 切速: 指的是Wafer移動速度. 主軸轉速: S1230: 30000~45000 RPM S1440: 30000~45000 RPM 27HEED: 35000~45000 RPM 27HCCD: 35000~45000 RPM 27HDDC: 35000~45000 RPM 晶 圓 切 割 (Dicing) 3.Dicing 相关材料 A Tape B Saw BLADE 切割刀 C DI 去离子水、RO 纯水