CAF测试结果解读白皮书.pdfVIP

White Paper on Interpreting CAF Test Results (10/20 12) CAF 测试结果解读白皮书（20 12 年 10 月） By Bob Neves, Chairman / CTO Microtek Changzhou Laboratories 作者：Bob Neves 麦可罗泰克（常州）实验室董事长兼技术总监 Conductive Anodic Filament (CAF) testing consists of placing customized CAF test coupons in a test chamber for between 500 and 1000 hours at high temperature and humidity conditions, then applying forcing potential to try to accelerate Ion Migration and CAF formation in the PCB test coupons. CAF 试验是把特制的 CAF 试验样板在高温高湿条件下放置 500 到 1000 小时，并施加偏置 电压，以加快离子迁移并促进在PCB 测试样板中 CAF 的形成。 In order to determine where the Ion Migration and CAF formation is progressing, electrical resistance measurements are periodically made to assess exactly how much current is flowing between the supposedly isolated features. Testing is primarily performed between adjacent through holes but testing is also commonly performed from Hole to Circuit, Circuit to Circuit and Layer to Layer. 为了确定离子迁移和 CAF 成形在何处发生，需要定期进行电阻测量，从而探测两个原定绝 缘的导体图形间精确的电流移动。测试通常在相邻通孔之见进行，但是测试也常常在孔- 电 路、电路- 电路、层-层进行。 CAF formation requires a path for current to flow along with the presence of an electrolyte (typically Br or Cl based) in order for the copper filament to form. In typical surface Electrochemical Migration (ECM) formation, metallic ions flow from the anode of the circuit toward the cathode where the pile up and grow back toward the anode source. In CAF formation, metals grow directly from the anode toward the cathode as the path for ions to flow is typically constricted and the traditional type of growth is not possible. CAF formation is a multiple step, sequential process that consists of (1) Pathway Formation/Creation, (2) Ion Migration along the pathway and (3) Growth of a Solid Copper Filament. CAF 的形成要求一条电流移动的通道和电解质（通常是溴化物或氯化物）的存在，从而让 铜细丝能够形成。在常规的表面电化学迁移（ECM ）的形成中，金属离子从电路的阳极流 出、往阴极流动，然后再阴极累积、并往阳极方向生长。在CAF 的形成中，金属直接从阳 极往阴极方向生长，因为离子移动的通道通常非常紧缩、常规