厚膜混合集成电路封装互连材料和工艺研究-材料工程专业论文.docxVIP

哈尔滨工业大学工程硕士学位论文 哈尔滨工业大学工程硕士学位论文 万方数据 万方数据 Abstract Thick film hybrid integrated circuit is an important part of microelectronic techniques, which is widely applied in civil, military and aerospace satellite fields. Compared with thin film technique, thick film technique owns many advantages such as easy process, low cost and especially cheap equipments. Among the thick techniques, electrical conductive pastes are one of the most important materials. It is necessary to study on sintering and soldering properties of the electrical conductive pastes due to their mechanical and electric connections for microelectronics. In this paper, the morphology, composition and mechanical properties of 6177T-Pd-Ag and 4093-Pt-Pd- Ag pads are investigated by corresponding techniques. Meanwhile, the fine sintering and soldering processes are obtained and it is very significant to direct the actual production. The thickness of the thick film pads is about 20 μm, which are fabricated by sintering the electrical conductive pastes on 96% alumina ceramic substrates. The sintering and soldering processes of the chick film pads are mainly studied. Considered morphology, composition and mechanical properties, the best electrical conductive paste is 4093-Pt-Pd-Ag. Then, current protectors are soldered on thick film pads using Sn62Pb36Ag2, and the joints have perfect properties. This process could greatly shorten the production cycles and reduce the cost. Upon the thick film sintering process, there are two different processes, such as process A and process B，which were explained in my paper. Process B is simple and could shorten the production cycles via studying the morphology of the different sintering processes. In this paper, reflow soldering is relatively simple among the three different soldering processes such as reflow soldering, manual soldering and vapor phase soldering. Compared with 6177T-Pd-Ag, the sintering bonding strength of 4093- Pt-Pd-Ag is high because of the Pt inhibiting