SMT地专业术语.doc

我这里有一些关于SMT的专业术语，和大家分享。?SMT :surface mount technology 表面黏着技术 ?AI :Auto-Insertion 自动插件?AQL :acceptable quality level 允收水平?ATE :automatic test equipment 自动测试?ATM :atmosphere 气压?BGA :ball grid array 球形矩阵?CCD :charge coupled device 监视连接组件(摄影机) ?CLCC :Ceramic leadless chip carrier 陶瓷引脚载具?COB :chip-on-board 芯片直接贴附在电路板上?cps :centipoises(黏度单位) 百分之一?CSB :chip scale ball grid array 芯片尺寸BGA ?CSP :chip scale package 芯片尺寸构装 ?CTE :coefficient of thermal expansion 热膨胀系数 ?DIP :dual in-line package 双内线包装(泛指手插组件) ?FPT :fine pitch technology 微间距技术?FR-4 :flame-retardant substrate 玻璃纤维胶片(用?硌u作PCB材质)?IC :integrate circuit 集成电路 ?IR :infra-red 红外线?Kpa :kilopascals(压力单位) ?LCC :leadless chip carrier 引脚式芯片承载器 ?MCM :multi-chip module 多层芯片模块 ?MELF :metal electrode face 二极管 ?MQFP :metalized QFP 金属四方扁平封装?NEPCON :National Electronic Package and ?Production Conference 国际电子包装及生产会议  ?PBGA lastic ball grid array 塑料球形矩阵?PCB rinted circuit board 印刷电路板?PLCC lastic leadless chip carrier 塑料式有引脚芯片承载器?ppm arts per million 指每百万PAD(点)有多少个不良PAD(点) ?psi ounds/inch2 磅/英吋?PWB rinted wiring board 电路板?QFP :quad flat package 四边平坦封装?SIP :single in-line package ?SIR :surface insulation resistance 绝缘阻抗?SMC :Surface Mount Component 表面黏着组件 ?SMD :Surface Mount Device 表面黏着组件?SMEMA :Surface Mount Equipment ?Manufacturers Association 表面黏着设备制造协会?SMT :surface mount technology 表面黏着技术?SOIC :small outline integrated circuit ?SOJ :small out-line j-leaded package ?SOP :small out-line package 小外型封装?SOT :small outline transistor 晶体管 ?SPC :statistical process control 统计过程控制?SSOP :shrink small outline package 收缩型小外形封装?TAB :tape automaticed bonding 带状自动结合?TCE :thermal coefficient of expansion 膨胀(因热)系数?Tg :glass transition temperature 玻璃转换温度?THD :Through hole device 须穿过洞之组件(贯穿孔) ?TQFP :tape quad flat package 带状四方平坦封装?UV :ultraviolet 紫外线?uBGA :micro BGA 微小球型矩阵 ?cBGA :ceramic BGA 陶瓷球型矩阵?PTH :Plated Thru Hole 导通孔 ?MESH 网目?OXIDE 氧化物?FLUX 助焊剂?LGA (Land Grid Arry)封装技术LGA封装不需植球，适合轻薄短小产