毫米波LTCC收发组件研究-电磁场与微波技术专业论文.docxVIP

Abstract．Low．Temperature Abstract． Low．Temperature Co．fired Ceramic(LTCC)technology is one type of Co‘fired cer锄ic multi—chip module(MCM．C)，which is a high—integration and multilayer- printed packaging technology．Its three—dimension(3D)structure brings a bran’new desi姐conception and methods into the domain of traditional microwave and millimeter-wave circuits＆systems．The focus of paper is that，based on LTCC packaging technology,integrate the millimeter-wave transceiver module into the LTCC multilayer substrate．This is an important step in the process of realizing compact， high．performance and