炉温曲线教材.pptVIP

Reflow Oven Profile Curve REFIOW形式(HEATER分佈) 183 oC 170oC Preheating Soaking Peak Cooling Preheating : Solvent evaporation 溶劑揮發 Soaking :Flux reduces and Metal oxides 助焊劑還原金屬氧化物 Peak: Solder balls melt, wetting and wicking begin. Solder melting completes, surface tension takes over. 錫球熔化,浸潤開始,焊接進行,表面張力起作用 Cooling : Cool down phase. 快速冷卻階段 140oC Reflow的製程條件 針對Intel RG82845 BGA soak zone time:50~65sec; ASUS 規範: Preheating Zone : *Solder Pastes’ Viscosity 錫膏黏度: 1.Solvent evaporation cause viscosity higher. 溶劑揮發使黏度變大 2.Heating solvent will cause viscosity down. 加熱溶劑會使黏度降低 High heating rate Viscosity Low heating rate Temperature 預熱段 各種錫膏在預熱段要求的升溫速律及進入恆溫區的溫度並不盡相同，其主要取決於溶劑(Solvent)的揮發溫度以及松香(Rosin)的軟化點。因松香在進入恆溫區的建議溫度時間時軟化，錫膏裡的溶劑尚是液態，此時錫膏為固液態，因此黏度最低，錫膏流動特性最佳，若預熱段升溫速率過高，錫膏黏度太低，流動特性太好，易造成Slump效應，進而產生短路及R/C旁擠出邊球，此時可適度將預熱段溫度降低，將有助於減少短路及Side Boll產生。 *Flux softness point : Flux softness point will decrease solder paste viscosity. 助焊劑(松香)軟化會降低錫膏黏性 High heating rate Low heating rate Very low heating rate Viscosity Temperature Soaking Zone : 1.Solvent evaporate completely 溶劑完全揮發 2.Flux activation and oxidation 助焊劑被激活並去氧化 3. Soaking time and temperature 3.1 For N2 oven the Soaking time can be longer. 3.2 For Air oven the Soaking time should shorter than N2 oven 4. PCB board bending control PCB板彎控制 Before Soaking After Soaking PCB PCB 恆溫區 恆溫區其目的再於使PCB上所有的零件溫度達到均溫，簡少零件熱衝擊，恆溫區的長度則取決於PCB面積的大小。此時錫膏內劑不斷揮發，活性劑持續作用去氧化，松香軟化並披覆在銲點上，具有熱保護及熱傳媒的作用。 恆溫區 *Plastic BGA After Soaking Plastic BGA PCB bending 由於PP的軟化溫度點為140 ℃,故如可考慮縮短Over 140 ℃的時間來改善空焊,此為一嶄新觀念,其實這種方法在實踐中被証明是有效的. Soaking Zone : *Homologous heating (PCB, Components and solder paste) 溫度達到一致(機板,零件,錫膏) *Solder paste viscosity control 錫膏黏性控制 *Solder wetting and wicking begin. 錫膏浸潤開始 *Surface solder balls melting. 表面焊料金屬熔融 Soaking Zone Plastic BGA substrate (Tg :1750C) PCB bending 1 2 3 2 Lead 1 Body 3 Pad Normal soldering Wicking Bridge by wic